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| Kühler News | Samstag, den 07.03.2009 | ||||
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These days, the need for a good T.I.M. - Thermal Interface Material is just as important as the heatsink we use for the critical parts of our computer, such as our CPU's, GPU's, etc. Let's face it. If the heat is not getting transferred between the components we are trying to cool and the heat sink our, components overheat. T.I.M. should be easy to apply, non conductive, should not need an excessive time to cure, and it should provide a good medium to transfer heat from our components to the heatsink we use to cool these components. Coolink has come up with a good solution. By utilizing a ceramic based T.I.M., which has gained strength in recent years as a good thermal interface as it does not break down in high or high fluctuating temperatures, we have something that is easy to apply, non conductive, and does not need an excessive curing time for it to be 100% effective.
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