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| Speicher News | Mittwoch, den 04.02.2009 | ||||
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If we are going by US prices, at the end of the day we think the G.Skill F3-12800CL8T-6GBHK with its Samsung HCF0 ICs have slightly more overhead than the Elpida-based Corsair DHX+ modules we looked at earlier this week - if your Core i7 CPU can stretch, the memory should accommodate. It may not have anything like the funky and more importantly, moddable (but also patented), DHX+ heatsinks on the Corsair but a case with good airflow should keep the G.Skill cool enough. Moreover, they have a lifetime warranty to cover mishaps and being low profile they're less likely to chance interference with a large CPU heatsink.
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