 |
|
| News Rubrik |
|
Alle Hardware News CPU News Gehäuse News Grafikkarten News Kühler News Mainboard News Netzteil News Speicher News Sonstige News Sponsoren News |
| Hardwarespot.de |
|
Hersteller Auswahl News Archiv Kurznews Impressum Forum |
| ocinside.de Portale |
|
Redaktion ocinside.de ocinside.de Fanshop Funkyhome.de |
| Empfehlung |
|
|
| Kühler News | Donnerstag, den 06.03.2008 | |||
| ||||
One particular category always stands out as the culprit for over-hyped promises. Thermal Interface Material or TIM. Of all the heatsink compounds and thermal pastes made and marketed, they must all only concentrate themselves to deliver the simple function of mating the CPU to the cooler with the highest thermal conductivity possible. Of course, some work better than others, and this is exactly what Benchmark Reviews intends to discover with 33 different TIM products.
|
| News Archiv | ||
|
Hardware News Archiv nach Datum anzeigen |
| Sprachauswahl |
 |
| Empfehlung |
|
| RSS Feeds |
 (E)
(D/E)
(D)
|