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| Speicher News | Montag, den 28.05.2007 | ||||
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The latest craze to hit the market over the last few months is the use of heat pipe technology to dissipate heat. This solution when properly designed and implemented coupled with good system airflow is a win-win proposition for all concerned as it is both quiet and effective at battling components' heat production. Recently this solution has transcended from the ranks of larger components such as memory sticks. Today we have the opportunity and pleasure to review a new memory product from OCZ, a name that is most certainly synonymous with quality in the computer products industry. We will be examining a 2GB DDR2 8500 kit from OCZ's Reaper HPC series of memory. The Reaper HPC series of memory uses the aforementioned heat pipe technology to help dissipate heat this improving performance. Is it effective?
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